Published on: May 2022
The sun is rising in the world of Low dielectric Resin with the market share shooting up slowly
From 2018 to 2023, the global low dielectric resin market is predicted to increase at a CAGR of 4.6 percent. The low dielectric resin market has a bright future, with applications in PCBs, wire and cable, antennas, microelectronics, and radomes. The increasing demand for high-performance PCBs and the rise of the wire and cable sector are the two primary growth drivers for this market. Increased usage of low dielectric resin in microfluidic chips for medical devices, as well as low dielectric resin in high speed PCBs for minimal signal loss and high frequency, are emerging developments that have a direct impact on the dynamics of the low dielectric resin sector.
Fluoropolymer - the backbone of Low dielectric Resin market growth
Fluoropolymer will continue to be the most popular resin type and will grow at the fastest rate throughout the forecast period, thanks to rising demand for high-performance PCB, wire & cable, and antenna applications. Due to increased demand for high performance PCB in the communication, defense, aerospace, and marine industries, PCB will remain the leading application in the low dielectric resin market over the projected period. Because of the strong increase in communication, portable, and military devices, the antenna application is likely to see the most growth throughout the forecast period, according to the study.
Due to increased manufacturing of electrical and electronic equipment in China, South Korea, Taiwan, and Japan, Asia Pacific is likely to remain the largest market and see the fastest growth over the projection period.
Huntsman, Lonza Group, Zeon, SABIC, Chemours, and others are among the low dielectric resin firms highlighted in this research.
Low Dielectric Resin Market Report: Trends, Forecast, and Competitive Analysis includes the following features:
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