Published on: May 2022
Uncover the market share of IC substrate with marketing insight
The Advanced IC Substrates Market (hereinafter referred to as the market examined') was worth USD 7.73 billion in 2020, and it is predicted to grow to USD 12.24 billion by 2027, with a CAGR of 6.85 percent between 2022 and 2027. Players are always improving packaging technologies in order to meet their rigorous demands for a smaller footprint, higher performance, and lower power consumption. Consumer electronics and mobile communication device demand is driving electronics makers to create ever-smaller and more portable products.
IC Substrate - New product additions to the market and more
The demand for sophisticated packaging is being driven by the growing trend of miniaturisation. The introduction of 5G, which has affected demand in recent years, is projected to continue, as the usage of FCBGA in 5G base stations and HPCs grows in nations around the world that have adopted the communication technology. Due to its routing density availability and ability to be customised for maximum electrical performance, FCBGA is likely to capture a considerable part of market demand. Unimicron, ASE Group, IBIDEN, and SCC are the major participants in this sector. Unimicron and Kinsus, for example, are boosting their substrate capacities. Unimicron spent TWD 20 billion on research and development and expanded its production capacity for sophisticated flip-chips substances through 2022.
Key market trends that affect the IC substrate business
Aside from that, the growing need for IC substrates is likely to be fueled by global IoT demand in both the consumer and industrial sectors. According to the Internet and Television Association, the global number of IoT devices will reach 50.1 billion by 2020, and industrial IoT demand will outpace consumer demand in the following years. Such changes are projected to have a favourable impact on the market. The advanced substrate business follows miniaturisation trends, deeper integration, and improved performance, resulting in significant investments by a number of firms in the ongoing ED and SLP packaging and a growing interest in such technologies.
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