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2D IC Flip Chip Product Market Global Growth, Trends and Forecast (2022 - 2027) By Types, By Application, By Regions and By Key Players: Intel (US), TSMC (Taiwan), ASE Group (Taiwan)

25 Mar, 2022 | 131 Pages
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The global market for 2D IC Flip Chip Product is expected to register a CAGR of more than 5.91% during the forecast period 2022-2027.



2D IC Flip Chip Product Market Overview



This leads to rapid growth in this industry among raw material suppliers. Its primary advantages over other packaging methods, namely, reliability, size, flexibility, performance, and cost, are the factors driving the growth of the 2D IC Flip Chip Product market. The availability of flip-chip raw materials, equipment, and services is further expected to drive the market lucratively during the forecast period. Being a technologically driven market, manufacturers are mainly focusing on innovations and on new technologies for the bumping process, which, in turn, is increasing the demand for raw materials required for manufacturing.  The demand for flip-chip is expected to rise in mobile and wireless, consumer applications, and other high-performance applications such as networks, servers, and data centers. In terms of 3D integration and more than the Moore approach, flip-chip is one of the key driving factors and helps enable sophisticated SoC (system on chip).



Recent Developments



November 2021 - Amkor Technology Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, planned to build a state-of-the-art smart factory in Bac Ninh, Vietnam. The first phase of the new factory would focus on providing advanced system in package (SiP) assembly and test solutions to the leading global semiconductor and electronic manufacturing companies.



What are the major Applications, Types and Regions for 2D IC Flip Chip Product Market?



2D IC Flip Chip Product Market is segmented based on the type, applications, companies and regions.



By Type, it is segmented into




  •     Copper Pillar

  •     Solder Bumping

  •     Tin-lead eutectic solder

  •     Lead-free solder

  •     Gold Bumping

  •     Others



By Applications, it is segmented into




  •     Electronics

  •     Industrial

  •     Automotive & Transport

  •     Healthcare

  •     IT & Telecommunication

  •     Aerospace and Defense

  •     Others



2D IC Flip Chip Product Market Regional Analysis



All these factors greatly affect the 2D IC Flip Chip Product market growth. It further aims at providing complete overview on detailed assessment of significant features of different industries including sales volume, market revenue, and demand size, sales growth, pricing analysis and changing market growth factors in regions such as Follows,




  • North America


    • US

    • Canada



  • Europe

    • Germany

    • France

    • UK

    • Italy

    • Spain

    • Rest of Europe



  • Asia-Pacific

    • China

    • Japan

    • India

    • Australia

    • South Korea

    • Rest of Asia-Pacific



  • Rest of the World

    • Middle East & Africa

    • Latin America





The 2D IC Flip Chip Product Market describes the factors driving the global growth opportunities in upcoming years and highlights market channels. In addition, the report analyzes market size and share, trends, by geographic region, end-use type and segment. It focuses extensively on revealing a detailed regional analysis. The Global 2D IC Flip Chip Product Market report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.



What is our 2D IC Flip Chip Product Market report scope?



Scope of the Report covers 2D IC Flip Chip Product Market with detailed analysis of the overall scenario for the market. It also highlights the business participants environment in the global marketplace. This report also provides an overview of leading companies covering the latest successful marketing strategies, market contributions, current and historical background and latest market happenings to help key organizations to grow and generate larger profits. Business players will greatly benefit from this 2D IC Flip Chip Product Market analysis report as it has vital details to provide about regional markets, expected opportunities for the prediction time period 2022-2027. Growth between segments is used to understand the different growth factors that are expected to dominate the market as a whole and to develop strategies to differentiate between key applications and target markets. It further reveals how worldwide market is working through efficient information graphics.























































Reports Attributes



Report Details



Forecast Period 2022 to 2027 CAGR



CAGR of 5.9 during the review period (2022 to 2027).



By Type




  • Copper Pillar

  • Solder Bumping

  • Tin-lead eutectic solder

  • Lead-free solder

  • Gold Bumping

  • Others



By Application




  • Electronics

  • Industrial

  • Automotive & Transport

  • Healthcare

  • IT & Telecommunication

  • Aerospace and Defense

  • Others



By Companies



Intel (US), TSMC (Taiwan), ASE Group (Taiwan), Amkor Technology (US), Samsung (South Korea), Powertech Technology (Taiwan), UMC (Taiwan), STMicroelectronics (Switzerland),



Regions Covered



• North America



• Europe



• Asia-Pacific



• Rest of the World



Countries Covered



• US



• Canada



• Germany



• France



• UK



• Italy



• Spain



• Rest of Europe



• China



• Japan



• India



• Australia



• South Korea



• Rest of Asia-Pacific



• Middle East & Africa



• Latin America



Base Year



2022



Historical Year



2017 to 2021



Forecast Year



2022 to 2027



Number of Pages



131



Customization Available



Yes, the report can be customized as per your needs




Key Takeaways from this 2D IC Flip Chip Product Report




  • Evaluate 2D IC Flip Chip Product market potential through analyzing growth rates (CAGR %), Volume (Units) and Value ($M) data given at country level - for product types, end use applications and by different industry verticals.

  • Understand the different dynamics influencing the market - growth driving factors, specific challenges and hidden opportunities.

  • Get in-depth insights on your competitor performance – revenue, shares, business strategies, financial benchmarking, product benchmarking, SWOT analysis and more.

  • Analyze the sales and distribution channels across geographies to enhance top-line revenues.

  • Understand the demanding supply chain with a deep dive on the value augmentation at each, in order to optimize value and bring efficiencies in your processes.

  • Get a quick outlook on the 2D IC Flip Chip Product market entropy - M&A's, deals, partnerships, product launches of all key players for the past 4 years.

  • Evaluate the import-export statistics, supply-demand and competitive landscape for more than top 20 countries globally for the market.



All our reports are custom made to your company needs to a certain extent, we do provide 5 free consulting hours along with purchase of each report, and this will allow you to request any additional data to customize the report as your needs.



Frequently Asked Questions



What is the study period of this market?



The 2D IC Flip Chip Product Market is studied from 2017 - 2027.



Who are the key players in 2D IC Flip Chip Product Market?



Intel (US), TSMC (Taiwan), ASE Group (Taiwan), Amkor Technology (US), Samsung (South Korea), Powertech Technology (Taiwan), UMC (Taiwan), STMicroelectronics (Switzerland), STATS ChipPAC (Singapore) and others.



What are the significant types of 2D IC Flip Chip Product Market?



Copper Pillar, Solder Bumping, Tin-lead eutectic solder, Lead-free solder, Gold Bumping, Others.



What are the major end-use applications of 2D IC Flip Chip Product Market?



Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace and Defense, Others.



What segments are covered in the 2D IC Flip Chip Product Market report?



The Global 2D IC Flip Chip Product Market is Segmented on the basic of Product, Application, and Geography.



How can I get a sample report/company profile for the 2D IC Flip Chip Product Market?



The sample report for the 2D IC Flip Chip Product Market can be obtained on demand from the website. Also, the 24*7 chat support & direct call services are provided to procure the sample report.


  1. INTRODUCTION

    1. MARKET DEFINATION

    2. MARKET DYNAMICS

    3. MARKET SEGMENTATION

    4. REPORT TIMLINES

    5. KEY STAKEHOLDERS



  2. RESEARCH METHODOLOGY

    1. DATA MINING

      1. SECONDARY RESEARCH

      2. PRIMARY RESEARCH

      3. SUBJECT MATTER EXPERT ADVICE



    2. QUALITY CHECK

    3. FINAL REVIEW

      1. DATA TRIANGULATION

      2. BOTTOM-UP APPROACH

      3. TOP-DOWN APPROACH

      4. RESEARCH FLOW





  3. EXECUTIVE SUMMARY

    1. INTRODUCTION

    2. GLOBAL 2D IC FLIP CHIP PRODUCT MARKET BY TYPES

    3. GLOBAL 2D IC FLIP CHIP PRODUCT MARKET BY APPLICATIONS



  4. MARKET DYNAMICS

    1. DRIVERS

      1. INCREASING DEMAND FOR 2D IC FLIP CHIP PRODUCT



    2. RESTRAINTS

      1. STRINGENT ENVIRONMENTAL REGUALTIONS

      2. HIGH COST ON MATERIALS



    3. OPPORTUNITIES

      1. 2D IC FLIP CHIP PRODUCT GROWTH

      2. APPLICATION OF 2D IC FLIP CHIP PRODUCT



    4. IMPACT OF COVID 19



  5. GLOBAL 2D IC FLIP CHIP PRODUCT MARKET, BY TYPES

    1.     Introduction

    2.     Copper Pillar

    3.     Solder Bumping

    4.     Tin-lead eutectic solder

    5.     Lead-free solder

    6.     Gold Bumping

    7.     Others              



  6. GLOBAL 2D IC FLIP CHIP PRODUCT MARKET, BY APPLICATION

    1.    Introduction

    2.     Electronics

    3.     Industrial

    4.     Automotive & Transport

    5.     Healthcare

    6.     IT & Telecommunication

    7.     Aerospace and Defense

    8.     Others   



  7. GLOBAL 2D IC FLIP CHIP PRODUCT MARKET, BY REGION

    1. NORTH AMERICA

      1. US

      2. CANADA

      3. MEXICO



    2. EUROPE

      1. GERMANY

      2. FRANCE

      3. UK

      4. ITALY

      5. RUSSIA

      6. REST OF EUROPE



    3. APAC

      1. CHINA

      2. SOUTH KOREA

      3. JAPAN

      4. INDIA

      5. AUSTRALIA

      6. ASEAN

      7. REST OF APAC



    4. MIDDLE EAST & AFRICA

      1. SAUDI ARABIA

      2. UAE

      3. SOUTH AFRICA

      4. TURKEY

      5. REST OF MEA



    5. SOUTH AMERICA

      1. BRAZIL

      2. REST OF MEA

      3. ARGENTINA

      4. REST OF SOUTH AMERICA





  8. COMPETITIVE LANDSCAPE

    1. MERGERS, ACQUISITIONS, JOINT VENTURES, COLLABORATIONS,

    2. AND AGREEMENTS

      1. KEY DEVELOPMENT



    3. MARKET SHARE (%) **/RANKING ANALYSIS

    4. STRATEGIES ADOPTED BY LEADING PLAYERS



  9. COMPANY PROFILES

    1. BUSINESS OVERVIEW

    2. COMPANY SNAPSHOT

    3. PRODUCT BENCHMARKING

    4. STRATEGIC INITIATIVES

      1. Intel (US),

      2. TSMC (Taiwan),

      3. ASE Group (Taiwan),

      4. Amkor Technology (US),

      5. Samsung (South Korea),

      6. Powertech Technology (Taiwan),

      7. UMC (Taiwan),

      8. STMicroelectronics (Switzerland),

      9. STATS ChipPAC (Singapore)







 

SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.

PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.

MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.

EXPERT VALIDATION
The market engineered data is verified and validated by a number of experts, both in-house and external.

REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.

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