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3D Chips (3D IC) Market - Global Growth, Trends and Forecast (2022 - 2027) By Types, By Application, By Regions, and By Key Players: ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Toshiba Corporation

23 Aug, 2022 | 160 Pages
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Registering a CAGR of 17.2% over the forecast period, the market value of 3D Chips (3D IC) is expected to reach US$ 10,570 million in the year 2027.



3D Chips (3D IC) Market Overview



The advancement of the microelectronics and semiconductor industries is driving the 3D Integrated Circuit Market. It aids in the enhancement of performance and functionality. It also helps to reduce power consumption in accordance with the needs of electronic devices. 3D integrated circuits are found in devices such as tablets, smartphones, computers, and so on. This increases battery life and saves a lot of space. Each IC stack is made up of cores, sensors, analogue RF circuits, and so on. Temporary effects, such as the COVID-19 outbreak, also slowed growth. However, it is expected that the 3D Integrated Circuit Market will resume growth in the coming years. As a result, both stakeholders and investors will profit greatly.



Three-dimensional integrated circuits are in high demand in industries such as aerospace and defence, memory, consumer electronics, and so on. Furthermore, the 3D Integrated Circuit Market is being fueled by the growing trend of 3D packaging for its benefits such as low cost, etc. The Asia-Pacific region is expected to dominate the Three-Dimensional Integrated Circuit market (3D IC). North America, on the other hand, accounts for the second-largest share.



The rising demand for high-bandwidth memory (HBM) chips is one of the factors driving the 3D IC Market. It improves the performance of networking devices by managing memory and bandwidth. As a result, removing the unnecessary components is the best solution for meeting market demand. In addition, the demand for improved connected devices to increase storage space is propelling the 3D IC Market forward. Growth will benefit from the development of a modern electronic device for high-speed data transmission. Furthermore, the smaller size of 3D integrated circuits contributes significantly to improved performance. These devices are also suitable for a variety of sensor applications as well as the microelectronics industry.



Who are the Major Players in the 3D Chips (3D IC) Market?



The global 3D Chips (3D IC) includes the identification and analysis of the various market participants competing in the global market. Prominent competitors include ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics, Broadcom, Intel, Jiangsu Changjiang Electronics Technology, TSMC, Micron Technology and others.



Industry News and Updates:



Samsung Electronics Creates the First 12-Layer 3D-TSV Chip Packaging Technology in the Industry



7th of October, 2019— Samsung Electronics, a global leader in advanced semiconductor technology, recently announced the development of the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is regarded as one of the most difficult packaging technologies for mass production of high-performance chips, requiring pinpoint accuracy to vertically interconnect 12 DRAM chips via a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.



What are the major Applications, Types, and Regions for the 3D Chips (3D IC) Market?



The market is segmented based on the type, applications, companies, and regions.



By Type, it is segmented into




  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)

  • 3D TSV

  • Others



By Application, it is segmented into




  • Consumer Electronics

  • Telecommunication

  • Automotive

  • Others



3D Chips (3D IC) Market Regional Analysis



The 3D Integrated Circuit Market Size is divided into four regions: Asia-Pacific, North America, Europe, and the Rest of the World. During the forecast period, the Asia-Pacific region is expected to have the largest market share. There are numerous factors that are heavily promoting the market. One of the most important factors is the countries' growing demand for consumer electronics. Furthermore, rising awareness of technological advancements and the use of smart devices is driving market growth in this region. Countries such as China, India, South Korea, Malaysia, and others are rapidly developing.



Following that, North America will have the second-largest 3D Integrated Circuit Market Share. One of the primary drivers of growth is the easy availability of raw materials and developed infrastructure. Furthermore, rising demand for Integrated Circuits in countries such as Canada and the United States is fueling growth.




  • North America


    • US

    • Canada



  • Europe

    • Germany

    • France

    • UK

    • Italy

    • Spain

    • Rest of Europe



  • Asia-Pacific

    • China

    • Japan

    • India

    • Australia

    • South Korea

    • Rest of Asia-Pacific



  • Rest of the World

    • Middle East & Africa

    • Latin America





The 3D Chips (3D IC) Market describes the factors driving the global growth opportunities in upcoming years and highlights market channels. In addition, the report analyzes market size and share, trends, by geographic region, end-use type, and segment. It focuses extensively on revealing a detailed regional analysis. The Global 3D Chips (3D IC) Market report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.



What is our 3D Chips (3D IC) Market report scope?



Scope of the Report covers 3D Chips (3D IC) Market with a detailed analysis of the overall scenario for the market. It also highlights the business participants’ environment in the global marketplace. This report also provides an overview of leading companies covering the latest successful marketing strategies, market contributions, current and historical background, and latest market happenings to help key organizations to grow and generate larger profits. Business players will greatly benefit from this 3D Chips (3D IC) Market analysis report as it has vital details to provide about regional markets and expected opportunities for the prediction time period 2022-2027. Growth between segments is used to understand the different growth factors that are expected to dominate the market as a whole and to develop strategies to differentiate between key applications and target markets. It further reveals how the worldwide market is working through efficient information graphics.



























































Report Attributes



Report Details



Report Title



3D Chips (3D IC) Market - Global Growth, Trends and Forecast (2022 - 2027) By Types, By Application, By Regions, and By Key Players: ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Toshiba Corporation



Forecast Period 2022 to 2027 CAGR



CAGR of 17.2% over the forecast period (2022-2027)



By Type




  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)

  • 3D TSV

  • Others



By Application




  • Consumer Electronics

  • Telecommunication

  • Automotive

  • Others



By Companies



ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics, Broadcom, Intel, Jiangsu Changjiang Electronics Technology, TSMC, Micron Technology



Regions Covered




  • North America

  • Europe

  • Asia-Pacific

  • Rest of the World



Countries Covered




  • US

  • Canada

  • Germany

  • France

  • UK

  • Italy

  • Spain

  • Rest of Europe

  • China

  • Japan

  • India

  • Australia

  • South Korea

  • Rest of Asia-Pacific

  • Middle East & Africa

  • Latin America



Base Year



2022



Historical Year



2017 to 2021



Forecast Year



2022 to 2027



Number of Pages



160



Customization Available



Yes, the report can be customized as per your needs




 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



 



Key Takeaways from this 3D Chips (3D IC) Report




  • Evaluate 3D Chips (3D IC) market potential through analyzing growth rates (CAGR %), Volume (Units), and Value ($M) data given at the country level - for product types, end-use applications, and different industries verticals.

  • Understand the different dynamics influencing the market - growth driving factors, specific challenges, and hidden opportunities.

  • Get in-depth insights on your competitor’s performance – revenue, shares, business strategies, financial benchmarking, product benchmarking, SWOT analysis, and more.

  • Analyze the sales and distribution channels across geographies to enhance top-line revenues.

  • Understand the demanding supply chain with a deep dive on the value augmentation at each, in order to optimize value and bring efficiencies to your processes.

  • Get a quick outlook on the 3D Chips (3D IC) market entropy – M&As, deals, partnerships, and product launches of all key players for the past 5 years.

  • Evaluate the import-export statistics, supply-demand, and competitive landscape for more than the top 20 countries globally for the market.



Frequently Asked Questions



What is the study period of this market?





The 3D Chips (3D IC) Market is studied from 2017 - 2027.



What is the growth rate of the 3D Chips (3D IC) Market?





The 3D Chips (3D IC) Market is growing at a CAGR of 17.2% over the next 5 years.



Who are the key players in 3D Chips (3D IC) Market?



ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics, Broadcom, Intel, Jiangsu Changjiang Electronics Technology, TSMC, Micron Technology



What regions does this 3D Chips (3D IC) Market report cover?





North America (the United States, Canada, and Mexico)

Europe (Germany, France, UK, Russia, and Italy)

Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)

South America (Brazil, Argentina, Colombia, etc.)

The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa)



What are the significant types of 3D Chips (3D IC) Market?



3D Wafer-Level Chip-Scale Packaging (WLCSP), 3D TSV, Others



What are the major end-use applications of 3D Chips (3D IC) Market?



Consumer Electronics, Telecommunication, Automotive, Others



 



All our reports are custom-made to your company’s needs to a certain extent, we do provide 5 free consulting hours along with the purchase of each report, and this will allow you to request any additional data to customize the report to your needs.


  1. INTRODUCTION

    1. MARKET DEFINITION

    2. MARKET DYNAMICS

    3. MARKET SEGMENTATION

    4. REPORT TIMELINES

    5. KEY STAKEHOLDERS



  2. RESEARCH METHODOLOGY

    1. DATA MINING

      1. SECONDARY RESEARCH

      2. PRIMARY RESEARCH

      3. SUBJECT MATTER EXPERT ADVICE



    2. QUALITY CHECK

    3. FINAL REVIEW

      1. DATA TRIANGULATION

      2. BOTTOM-UP APPROACH

      3. TOP-DOWN APPROACH



    4. RESEARCH FLOW



  3. EXECUTIVE SUMMARY

    1. INTRODUCTION

    2. GLOBAL 3D CHIPS (3D IC) MARKET BY APPLICATION

    3. GLOBAL 3D CHIPS (3D IC) MARKET BY TYPES



  4. MARKET DYNAMICS

    1. DRIVERS

    2. INCREASING DEMAND FOR GLOBAL 3D CHIPS (3D IC) RESTRAINTS

      1. STRINGENT ENVIRONMENTAL REGULATIONS

      2. HIGH COST OF RAW MATERIAL



    3. OPPORTUNITIES

      1. GLOBAL 3D CHIPS (3D IC) GROWTH

      2. APPLICATION OF GLOBAL 3D CHIPS (3D IC)



    4. IMPACT OF COVID 19



  5. GLOBAL 3D CHIPS (3D IC) MARKET, BY TYPES

    1. INTRODUCTION

    2. 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)

    3. 3D TSV

    4. OTHERS



  6. GLOBAL 3D CHIPS (3D IC) MARKET, BY APPLICATION

    1. INTRODUCTION

    2. CONSUMER ELECTRONICS

    3. TELECOMMUNICATION

    4. AUTOMOTIVE

    5. OTHERS



  7. GLOBAL 3D CHIPS (3D IC) MARKET, BY REGION

    1. NORTH AMERICA

      1. US

      2. CANADA

      3. MEXICO



    2. EUROPE

      1. GERMANY

      2. FRANCE

      3. UK

      4. ITALY

      5. RUSSIA

      6. REST OF EUROPE



    3. APAC

      1. CHINA

      2. SOUTH KOREA

      3. JAPAN

      4. INDIA

      5. AUSTRALIA

      6. ASIAN

      7. REST OF APAC



    4. MIDDLE EAST & AFRICA

      1. SAUDI ARABIA

      2. UAE

      3. SOUTH AFRICA

      4. TURKEY

      5. REST OF MEA



    5. SOUTH AMERICA

      1. BRAZIL

      2. REST OF MEA

      3. ARGENTINA

      4. REST OF SOUTH AMERICA





  8. COMPETITIVE LANDSCAPE

    1. MERGERS, ACQUISITIONS, JOINT VENTURES, COLLABORATIONS,

    2. AND AGREEMENTS

      1. KEY DEVELOPMENT



    3. MARKET SHARE (%) **/RANKING ANALYSIS

    4. STRATEGIES ADOPTED BY LEADING PLAYERS



  9. COMPANY PROFILES

    1. BUSINESS OVERVIEW

    2. COMPANY SNAPSHOT

    3. PRODUCT BENCHMARKING

    4. STRATEGIC INITIATIVES

      1. ASE GROUP

      2. SAMSUNG ELECTRONICS CO., LTD.

      3. STMICROELECTRONICS N.V.

      4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

      5. TOSHIBA CORPORATION

      6. AMKOR TECHNOLOGY

      7. UNITED MICROELECTRONICS

      8. STMICROELECTRONICS

      9. BROADCOM

      10. INTEL

      11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY

      12. TSMC

      13. MICRON TECHNOLOGY





SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.

PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.

MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.

EXPERT VALIDATION
The market engineered data is verified and validated by a number of experts, both in-house and external.

REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.

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