Registering a CAGR of 8.3% over the forecast period, the market value of Copper Pillar Flip Chip is expected to reach US$ 16 billion in the year 2027.
As the industry has continued to push Copper Pillar Flip Chip applications to bump pitches of 150m and below, significant assembly challenges related to underfilling Copper Pillar Flip Chip assemblies on laminate substrates have arisen as chip stand-offs have decreased. Copper Pillar Flip Chip bumping has emerged as an appealing option for high-end computing, as well as wireless Copper Pillar Flip Chip, System in Package (SiP) applications, where the predictable stand-off of a copper post can effectively minimize assembly and underfilling problems.
The advancement of the copper pillar and micro bumping metallurgy, as well as its widespread application in consumer electronics and mobile phones, are driving up demand for Copper Pillar Flip Chip technology. Bumping methods currently in use support the most advanced manufacturing techniques, allowing the Copper Pillar Flip Chip process to be modified to meet new challenges. Copper Pillar Flip Chip technology has become a well-known medium- and high-range technology due to its improved performance capabilities. The growing demand for mobile wireless, computer, and consumer applications is propelling the market for flip-chip technology forward.
The report aspects discussed the profile of the top manufacturers of the global Copper Pillar Flip Chip market. These aspects include the financial status of major companies, trending advancements, and the entire market scenario. Growth of the report has examined Copper Pillar Flip Chip Market production, demand and growth potential, geographic analysis, as well as current market developments in various regions and countries.
The global Copper Pillar Flip Chip includes the identification and analysis of the various market participants competing in the global market. Prominent competitors include Intel (US), TSMC (Taiwan), ASE Group (Taiwan), Amkor Technology (US), Samsung (South Korea), Powertech Technology (Taiwan), UMC (Taiwan), STMicroelectronics (Switzerland), STATS ChipPAC (Singapore) and others.
Qorvo has been awarded a DoD contract to advance copper-pillar-on-GaN technology.
May 20, 2020 - Qorvo® (Nasdaq:QRVO), a global leader in innovative RF solutions, has been awarded a three-year contract to advance the development of copper-pillar-on-GaN flip-chip technology. This DoD programme will establish a high-yield domestic foundry to advance the copper flip assembly process, which enables vertical die stacking in space-constrained phased array radar systems and other defence electronics.
The market is segmented based on the type, applications, companies, and regions.
By Type, it is segmented into
By Application, it is segmented into
According to the Copper Pillar Flip Chip Technology Market Statistics, the Asia Pacific region will dominate the global Copper Pillar Flip Chip on Board Market during the assessment period. Various countries, such as India and China, are key manufacturing hubs and are expected to provide ample opportunities for massive growth in the Copper Pillar Flip Chip on Board Market. As a result, the presence of numerous major companies in this region is propelling the growth of the Copper Pillar Flip Chip on Board Market.
Furthermore, North America has the world's second-largest Copper Pillar Flip Chip Technology Market share. The Copper Pillar Flip Chip Technology Market in North America is rapidly expanding due to significant investments and the presence of major players in development and research activities.
The Copper Pillar Flip Chip Market describes the factors driving the global growth opportunities in upcoming years and highlights market channels. In addition, the report analyzes market size and share, trends, by geographic region, end-use type, and segment. It focuses extensively on revealing a detailed regional analysis. The Global Copper Pillar Flip Chip Market report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.
Scope of the Report covers Copper Pillar Flip Chip Market with a detailed analysis of the overall scenario for the market. It also highlights the business participants’ environment in the global marketplace. This report also provides an overview of leading companies covering the latest successful marketing strategies, market contributions, current and historical background, and latest market happenings to help key organizations to grow and generate larger profits. Business players will greatly benefit from this Copper Pillar Flip Chip Market analysis report as it has vital details to provide about regional markets and expected opportunities for the prediction time period 2022-2027. Growth between segments is used to understand the different growth factors that are expected to dominate the market as a whole and to develop strategies to differentiate between key applications and target markets. It further reveals how the worldwide market is working through efficient information graphics.
Report Attributes | Report Details |
Report Title | Copper Pillar Flip Chip Market - Global Growth, Trends and Forecast (2022 - 2027) By Types, By Application, By Regions, and By Key Players: Intel (US), TSMC (Taiwan), ASE Group (Taiwan), Amkor Technology (US), Samsung (South Korea) |
Forecast Period 2022 to 2027 CAGR | CAGR of 8.3% over the forecast period (2022-2027) |
By Type |
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By Application |
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By Companies | Intel (US), TSMC (Taiwan), ASE Group (Taiwan), Amkor Technology (US), Samsung (South Korea), Powertech Technology (Taiwan), UMC (Taiwan), STMicroelectronics (Switzerland), STATS ChipPAC (Singapore) |
Regions Covered |
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Countries Covered |
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Base Year | 2022 |
Historical Year | 2017 to 2021 |
Forecast Year | 2022 to 2027 |
Number of Pages | 138 |
Customization Available | Yes, the report can be customized as per your needs |
What is the study period of this market?
The Copper Pillar Flip Chip Market is studied from 2017 - 2027.
What is the growth rate of the Copper Pillar Flip Chip Market?
The Copper Pillar Flip Chip Market is growing at a CAGR of 8.3% over the next 5 years.
Who are the key players in Copper Pillar Flip Chip Market?
Intel (US), TSMC (Taiwan), ASE Group (Taiwan), Amkor Technology (US), Samsung (South Korea), Powertech Technology (Taiwan), UMC (Taiwan), STMicroelectronics (Switzerland), STATS ChipPAC (Singapore)
What regions does this Copper Pillar Flip Chip Market report cover?
North America (the United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, and Italy)
Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)
South America (Brazil, Argentina, Colombia, etc.)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa)
What are the significant types of Copper Pillar Flip Chip Market?
3D IC, 2.5D IC, 2D IC
What are the major end-use applications of Copper Pillar Flip Chip Market?
Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace and Defense, Others
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SECONDARY RESEARCH
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PRIMARY RESEARCH
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MARKET ENGINEERING
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REPORT WRITING/ PRESENTATION
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