Acknowledging the kind of traction gained by this market, recently published a study report asserts the global ESD Protective Packaging Market size is projected to accrue voluminously by 2027 registering a phenomenal CAGR of 7.9% during the review period (2022 to 2027).
ESD Protective Packaging Market Overview
ESD packaging is also a good idea in electronics since integrated circuits are made of semiconductor materials like silicon and insulating materials that might be damaged by high voltages. To avoid this problem, integrated circuit manufacturers and users must take measures and utilize the proper packaging materials and printing procedures.
ESD protective packaging is used in automotive, defense & military, manufacturing, healthcare, and aerospace for various operational uses. With the help of ESD packages, the products can be securely transferred from one place to another, preventing electrostatic or static electricity from damaging electronic items in transit. When two differently charged items come into contact or even come close to one another, electrostatic discharge occurs. Electrostatic discharge can completely destroy any printed circuit board. Increased use of these packages by various end-use industries is predicted to drive the market in the forecast period. In addition, ESD packages provide safety to the product from inflammable liquids and gases. Such packaging materials are designed to promote the direct flow of electricity causing zero damage to the materials inside. ESD packaging is a safe and secure way of packaging which provides more safety as compared to other packages and hence, the market is predicted to grow in the forecast timeframe.
Recent Developments:
2017 : Pregis has acquired Sussex, Wisconsin-based Sharp Packaging Systems for an undisclosed amount. The acquisition will enable Pregis to expand its product portfolio to include a complete line of flexible packaging bagging systems and materials.
Who are the Major Players in ESD Protective Packaging Market?
The global ESD Protective Packaging includes identification and analysis of the various market participants competing in the global market. Prominent competitors include Miller Packaging, Desco Industries, Dou Yee, BHO TECH, DaklaPack, Sharp Packaging Systems, Mil-Spec Packaging, Polyplus Packaging, Pall Corporation, TIP Corporation, Kao Chia, Selen Science & Technology, TA&A, Sanwei Antistatic, Btree Industry, ACE ESD(Shanghai), Junyue New Material, Betpak Packaging, Heyi Packaging
What are the major Applications, Types and Regions for ESD Protective Packaging Market?
ESD Protective Packaging Market is segmented based on the type, applications, companies and regions.
By Type, it is segmented into
By Application it is segmented into
- Electronic Industry
- Chemical Industry
- Pharmaceutical Industry
- Other
ESD Protective Packaging Market Regional Analysis
The market in the North American region is anticipated to hold the largest market share during the forecast period. In previous year, the North American market had a value of $1,156.60 million. A CAGR of 7.9 % is anticipated for the analysis period. The demand for transportation and customised packaging of technological equipment to prevent damage has increased as a result of the growth in the usage of these devices in the manufacturing and automotive industries. The packaging of electrostatically sensitive products or those that contain flammable liquids or gases has thus witnessed an increase in demand. The presence of several manufacturing facilities for these materials throughout the region is anticipated to fuel regional market growth during the projection period.
- North America
- Europe
- Germany
- France
- UK
- Italy
- Spain
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- Australia
- South Korea
- Rest of Asia-Pacific
- Rest of the World
- Middle East & Africa
- Latin America
What is our ESD Protective Packaging Market report scope?
Report Attributes
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Report Details
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Forecast Period 2022 to 2028 CAGR
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CAGR of 7.9% during the review period (2022 to 2027).
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By Type
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By Application
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- Electronic Industry
- Chemical Industry
- Pharmaceutical Industry
- Others
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By Companies
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Miller Packaging, Desco Industries, Dou Yee, BHO TECH, DaklaPack, Sharp Packaging Systems, Mil-Spec Packaging, Polyplus Packaging, Pall Corporation, TIP Corporation, Kao Chia, Selen Science & Technology, TA&A, Sanwei Antistatic, Btree Industry, ACE ESD(Shanghai), Junyue New Material, Betpak Packaging, Heyi Packaging
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Regions Covered
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- North America
- Europe
- Asia-Pacific
- Rest of the World
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Countries Covered
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- US
- Canada
- Germany
- France
- UK
- Italy
- Spain
- Rest of Europe
- China
- Japan
- India
- Australia
- South Korea
- Rest of Asia-Pacific
- Middle East & Africa
- Latin America
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Base Year
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2022
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Historical Year
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2017 to 2021
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Forecast Year
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2022 to 2027
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Number of Pages
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162
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Customization Available
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Yes, the report can be customized as per your needs
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Key Takeaways from this ESD Protective Packaging Report
- Evaluate ESD Protective Packaging market potential through analyzing growth rates (CAGR %), Volume (Units) and Value ($M) data given at country level - for product types, end use applications and by different industry verticals.
- Understand the different dynamics influencing the market - growth driving factors, specific challenges and hidden opportunities.
- Get in-depth insights on your competitor performance – revenue, shares, business strategies, financial benchmarking, product benchmarking, SWOT analysis and more.
- Analyze the sales and distribution channels across geographies to enhance top-line revenues.
- Market share held by each application segment with respect to the market renumeration and sales estimates over the forecast timeline are stated in the report.
- Understand the demanding supply chain with a deep dive on the value augmentation at each, in order to optimize value and bring efficiencies in your processes.
- Get a quick outlook on the ESD Protective Packaging market entropy - M&A's, deals, partnerships, product launches of all key players for the past 4 years.
- Evaluate the import-export statistics, supply-demand and competitive landscape for more than top 20 countries globally for the market.
- It further investigates the specifics that are positively impacting the profit graph of this business sphere.
- The study also elaborates the critical factors which will augment the commercial terrain of the ESD Protective Packaging market.
All our reports are custom made to your company needs to a certain extent, we do provide 5 free consulting hours along with purchase of each report, and this will allow you to request any additional data to customize the report as your needs.
Frequently Asked Questions
What is the study period of this market?
The ESD Protective Packaging Market is studied from 2017 - 2027.
What is the growth rate of ESD Protective Packaging Market?
The ESD Protective Packaging Market is growing at a CAGR of 7.9% over the next 5 years.
Who are the leading key players in ESD Protective Packaging Market?
Miller Packaging, Desco Industries, Dou Yee, BHO TECH, DaklaPack, Sharp Packaging Systems, Mil-Spec Packaging, Polyplus Packaging, Pall Corporation, TIP Corporation, Kao Chia, Selen Science & Technology, TA&A, Sanwei Antistatic, Btree Industry, ACE ESD(Shanghai), Junyue New Material, Betpak Packaging, Heyi Packaging
What regions does this ESD Protective Packaging Market report covers?
North America (the United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, and Italy)
Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)
South America (Brazil, Argentina, Colombia, etc.)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa)
What are the significant types of ESD Protective Packaging Market?
Bag, Sponge, Grid, Others
What are the significant Applications of ESD Protective Packaging Market?
Electronic Industry, Chemical Industry, Pharmaceutical Industry, Others
SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.
PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.
MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.
EXPERT VALIDATION
The market engineered data is verified and validated by a number of experts, both in-house and external.
REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.
