Over the next five years the High Bandwidth Memory market will register a 25.4% CAGR in terms of revenue, the global market size will reach USD 4088.5 million by 2027.
The high bandwidth memory market was valued at USD 1068.2 million in 2020, and it is expected to reach a value of USD 4088.5 million by 2027, registering a CAGR of 25.4% over the forecast period 2022-2027. Major factors driving the evolution of the high bandwidth memory (HBM) market include the growing need for high-bandwidth, low power consumption, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of reduction of electronic devices. With the growing graphics application, the appetite for fast information delivery (bandwidth) has also increased. Therefore HBM memory performs better than a GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.
The report aspects discussed the profile of the top manufacturers of the global High Bandwidth Memory market. These aspects include financial status of major companies, trending advancements and entire market scenario. Growth of the report have examined High Bandwidth Memory Market production, demand and growth potential, geographic analysis, as well as current market developments in various regions and countries.
The High Bandwidth Memory Market is growing at a very fast pace and has seen the focus of many local and regional vendors offering precise application products for multiple end users. The three dependencies for the status of major companies in the market are: company profile, profitable gross margin, the prices they charge. These are the main players in this market Advanced Micro Devices, Intel, SAMSUNG, SK HYNIX, XILINX and others.
Industry News:
New AMD Radeon PRO W6000 Series Workstation Graphics with AMD RDNA 2 Architecture and Massive 32GB of Memory to Power Demanding Architectural, Design and Media Workloads
June 08, 2021: AMD (NASDAQ: AMD) today announced the AMD Radeon™ PRO W6000 series workstation graphics, delivering exceptional performance, stability and reliability for professional users. The new graphics products were designed and optimized to power demanding architectural design workloads, ultra-high resolution media projects, complex design and engineering simulations, and advanced image and video editing applications.
February 17, 2021: Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications.
High Bandwidth Memory Market provides details by vendors, including company total revenue (financials), company overview, market potential, global presence, his business report briefly talks about market performance of each business sector covering growth factors and sales volume. this analysis provides the This High Bandwidth Memory Market analysis report provides recent trends, granular level data covering market size and share. It provides all the recent updates about CORONA virus and its impact on world economy and human health. By getting this data, key players can obtain profit making and right business opportunities for future growth. Its further guides to increase the product demand and business expansion.
By Type, it is segmented into
By Applications it is segmented into
North America high bandwidth memory market dominated the global market in 2021 owing to revolution of 5G networking technology due to the evolving rolling out of smart solutions like AI, machine learning, internet edge and the continual growth of high bandwidth memory across North America. Moreover, Asia Pacific is estimated to grow at the highest CAGR during forecast period owing to the growing investments for better infrastructure as well as demand for high-speed information and other low latency application efficiently.
The High Bandwidth Memory Market describes the factors driving the global growth opportunities in upcoming years and highlights market channels. In addition, the report analyzes market size and share, trends, by geographic region, end-use type and segment. It focuses extensively on revealing a detailed regional analysis. The Global High Bandwidth Memory Market report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.
Report Attributes
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Report Details |
Forecast Period 2022 to 2027 CAGR |
CAGR of 25.4% during the review period (2022 to 2027). |
By Type |
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By Application |
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By Companies
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Advanced Micro Devices, Intel, SAMSUNG, SK HYNIX, XILINX
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Regions Covered
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Countries Covered |
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Base Year
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2022 |
Historical Year
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2017 to 2021 |
Forecast Year
| 2022 to 2027 |
Number of Pages | 95 |
Customization Available
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Yes, the report can be customized as per your needs |
All our reports are custom made to your company needs to a certain extent, we do provide 5 free consulting hours along with purchase of each report, and this will allow you to request any additional data to customize the report as your needs.
What is the study period of this market?
The High Bandwidth Memory Market is studied from 2017 - 2027.
What is the growth rate of High Bandwidth Memory Market?
The High Bandwidth Memory Market is growing at a CAGR of 25.4% over the next 5 years.
Who are the key players in High Bandwidth Memory Market?
Advanced Micro Devices, Intel, SAMSUNG, SK HYNIX, XILINX
What region does this High Bandwidth Memory Market report covers?
North America (the United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, and Italy)
Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)
South America (Brazil, Argentina, Colombia, etc.)
The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, and South Africa)
What are the significant types of High Bandwidth Memory Market?
Graphics Processing Unit (GPU), Central Processing Unit (CPU), Accelerated Processing Unit (APU)
What are the major end-use applications of High Bandwidth Memory Market?
Graphics, High-performance Computing, Networking, Data Centers
SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.
PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.
MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.
EXPERT VALIDATION
The market engineered data is verified and validated by a number of experts, both in-house and external.
REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.
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