Manufacturing & Construction / Die Bonder Equipment Market - Growth, Trends And Forecast (2022 - 2027) By Types, By Application, By Regions And By Key Players - Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies
Die Bonder Equipment Market - Growth, Trends And Forecast (2022 - 2027) By Types, By Application, By Regions and By Key Players - Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies
Acknowledging the kind of traction gained by this market, recently published a study report asserts the global Die Bonder Equipment Market size is projected to accrue voluminously by 2027 registering a phenomenal CAGR of around 3.5% during the review period (2022 to 2027).
Die Bonder Equipment Market Overview
The increasing adoption of hybrid laptops, high definition television, and growing urbanization will emerge as the main aspect driving market growth. The numerous growth factors such as the Introduction of stacked die technology in internet of things enabled devices, surging demand of 3D semiconductor assembly and packaging and increasing demand of semiconductor integrated circuits predictable to increase the overall growth of the market for the forecast period of 2022 to 2027. In addition to this, the features such as the growing demand for miniature electronic components and the growing adoption of stacked die technology in IOT devices will further aggravate the market value for the forecast period. On the other hand, the high cost of ownership, act as a restraint for the market.
Industry News:
Kulicke & Soffa Expands Thermal Compression Bonding Capabilities to Accelerate Innovation in the Integration of Semiconductor and Silicon Photonics
Feb 01, 2022: Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) ("Kulicke & Soffa", "K&S" or the "Company"), a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, announced it is expanding its Thermal Compression Bonding (TCB) capabilities to accelerate innovation in the integration of semiconductor and Silicon Photonics.
What are the major Applications, Types and Regions for Die Bonder EquipmentMarket?
By Type, it is segmented into
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
others
By Applications
Fully Automatic
Semi-Automatic
Manual
Others
Die Bonder Equipment Market Regional Analysis
Growing IC demand due to increasing smartphones and tablets production will make the region grow at a healthy pace in future. Moreover, the market for die bonder equipment in North America and Europe is also projected to grow at a healthy pace owing to increasing demand for semiconductors ICs from the region.The fast adoption of new and latest technologies in the region is also expected to drive the market in the region. Furthermore, MEA and Latin America are also expected to create demand for die bonder equipment in future as the market in these regions is in the growing stage as compared to other regions.
North America
US
Canada
Europe
Germany
France
UK
Italy
Spain
Rest of Europe
Asia-Pacific
China
Japan
India
Australia
South Korea
Rest of Asia-Pacific
Rest of the World
Middle East & Africa
Latin America
What is our Die Bonder Equipment Market report scope?
Report Attributes
Report Details
Forecast Period 2022 to 2027 CAGR
CAGR of 3.5 % during the review period (2022 to 2027).
Yes, the report can be customized as per your needs
Key Takeaways from this Healthcare IT Report
Evaluate Die Bonder Equipment Market potential through analyzing growth rates (CAGR %), Volume (Units) and Value ($M) data given at country level - for product types, end use applications and by different industry verticals.
Understand the different dynamics influencing the market - growth driving factors, specific challenges and hidden opportunities.
Get in-depth insights on your competitor performance – revenue, shares, business strategies, financial benchmarking, product benchmarking, SWOT analysis and more.
Analyze the sales and distribution channels across geographies to enhance top-line revenues.
Understand the demanding supply chain with a deep dive on the value augmentation at each, in order to optimize value and bring efficiencies in your processes.
Get a quick outlook on the Die Bonder Equipment Market entropy - M&A's, deals, partnerships, product launches of all key players for the past 4 years.
Evaluate the import-export statistics, supply-demand and competitive landscape for more than top 20 countries globally for the market.
All our reports are custom made to your company needs to a certain extent, we do provide 5 free consulting hours along with purchase of each report, and this will allow you to request any additional data to customize the report as your needs.
Frequently Asked Questions
What is the study period of this market?
The Die Bonder Equipment Market is studied from 2017 - 2027.
What is the growth rate of Die Bonder Equipment Market?
The Die Bonder Equipment Market is growing at a CAGR of 3.5% over the next 5 years.
Who are the key players in Die Bonder Equipment Market?
SECONDARY RESEARCH Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.
PRIMARY RESEARCH Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.
MARKET ENGINEERING The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.
EXPERT VALIDATION The market engineered data is verified and validated by a number of experts, both in-house and external.
REPORT WRITING/ PRESENTATION After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.