Global Surface Mount Technology (SMT) Equipment Market Size from US$ 5400 million in 2022, will reach US$ 6636.7 million by 2027 is expected to witness Growth rate 5.3% CAGR during Forecast 2022 - 2027
Surface Mount Technology (SMT) is technique used to produce electronic circuit. In this particular technology, components of electronic circuit are directly placed onto the surfaced printed circuit boards (PCBs). An SMT is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface or PCBs. In this way, the electronic device made is called surface-mount device. (SMD).
In the coming years there is an increasing demand for Surface Mount Technology (SMT) Equipment in the regions of China that is expected to drive the market for more Surface Mount Technology (SMT) Equipment. Increasing of telecommunications equipment expenditures, more-intense competition, launches in introducing new products, increasing of spending on medical and automotive industry, retrofitting and renovation of old technology, increasing adoption of Surface Mount Technology (SMT) Equipment will drive growth in North America and Europe markets.
The global Surface Mount Technology (SMT) Equipment includes the identification and analysis of the various market participants competing in the global market. Prominent competitors include ASM Assembly Systems GmbH & Co. KG, CyberOptics Corporation (NasdaqGM:CYBE), Electro Scientific Industries, Inc., Fuji Corporation (Tokyo:6134.T), Glenbrook Technologies, Inc., Heller Industries, Inc., Illinois Tool Works Inc. (NYSE:ITW)., Juki Corporation (Tokyo :6440.T), Koh Young Technology Inc. (KOSDAQ:098460.KQ)., Kulicke & Soffa Pte Ltd., Mycronic AB, Naprotek, Inc., Nikon Metrology NV, Nordson DAGE, OMRON Corporation (Tokyo:6645.T), Orbotech, Ltd., Panasonic Corporation, Saki Corporation, Teradyne, Inc. (NasdaqGS:TER)., Universal Instruments Corporation, Viscom AG (XETRA :V6C.DE), Yamaha Motor Co., Ltd. (Other OTC:YAMHF)., YXLON International GmbH
Industry News and Updates:
29-Jan-2021 :ASM Pacific Technology and the EV Group have joined forces to provide the industry's first ultra-precision die-to-wafer hybrid bonding solutions for 3D-IC heterogeneous integration.
ASM PACIFIC TECHNOLOGY (ASMPT) and EV GROUP (EVG) have announced the signing of a JDA to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a critical process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology—combining chips from different process nodes into advanced packaging systems capable of powering new applications such as 5G, high-performance computing (HPC), and artificial intelligence (AI).
Surface Mount Technology (SMT) Equipment Market is segmented based on the type, applications, companies and regions.
Segment by Type
Segment by Application
The U.S. Market is Estimated at US$302.3 Million, While Asia-Pacific is Forecast to Grow at 6.5% CAGR
Surface Mount Technology (SMT) Equipment market in the U.S. is estimated at US$30.2.3 million.Asia-Pacific is forecast to reach a projected market size of US$1 billion, trailing a CAGR of 6.5%. Among the other noteworthy geographic markets are Japan, China and Europe, each forecast to grow at a CAGR of 4.9%, 7.2% and 3.9% respectively.
The report incorporates in-depth assessment of the competitive landscape, product market sizing, product benchmarking, market trends, product developments, financial analysis, strategic analysis and so on to gauge the impact forces and potential opportunities of the market. Apart from this the report also includes a study of major developments in the market such as product launches, agreements, acquisitions, collaborations, mergers and so on to comprehend the prevailing market dynamics at present and its impact during the forecast period 2022-2027. The report presents the analysis of Surface Mount Technology (SMT) Equipment Market for the historical period of 2017-2021 and the forecast period of 2022-2027.
Reports Attributes | Report Details |
Forecast Period 2022 to 2027 CAGR | CAGR of 5.3% during the review period (2022 to 2027). |
By Type |
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By Application |
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By Companies | ASM Assembly Systems GmbH & Co. KG, CyberOptics Corporation (NasdaqGM:CYBE), Electro Scientific Industries, Inc., Fuji Corporation (Tokyo:6134.T), Glenbrook Technologies, Inc., Heller Industries, Inc., Illinois Tool Works Inc. (NYSE:ITW)., Juki Corporation (Tokyo :6440.T), Koh Young Technology Inc. (KOSDAQ:098460.KQ)., Kulicke & Soffa Pte Ltd., Mycronic AB, Naprotek, Inc., Nikon Metrology NV, Nordson DAGE, OMRON Corporation (Tokyo:6645.T), Orbotech, Ltd., Panasonic Corporation, Saki Corporation, Teradyne, Inc. (NasdaqGS:TER)., Universal Instruments Corporation, Viscom AG (XETRA :V6C.DE), Yamaha Motor Co., Ltd. (Other OTC:YAMHF)., YXLON International GmbH |
Regions Covered | • North America • Europe • Asia-Pacific • Rest of the World |
Countries Covered | • US • Canada • Germany • France • UK • Italy • Spain • Rest of Europe • China • Japan • India • Australia • South Korea • Rest of Asia-Pacific • Middle East & Africa • Latin America |
Base Year | 2022 |
Historical Year | 2017 to 2021 |
Forecast Year | 2022 to 2027 |
Number of Pages | 115 |
Customization Available | Yes, the report can be customized as per your needs |
All our reports are customizable to your company needs to a certain extent, we do provide 5 free consulting hours along with purchase of each report, and this will allow you to request any additional data to customize the report to your needs.
What is the study period of this market?
The Surface Mount Technology (SMT) Equipment Market is studied from 2017 - 2027.
Who are the key players in Surface Mount Technology (SMT) Equipment Market?
ASM Assembly Systems GmbH & Co. KG, CyberOptics Corporation (NasdaqGM:CYBE), Electro Scientific Industries, Inc., Fuji Corporation (Tokyo:6134.T), Glenbrook Technologies, Inc., Heller Industries, Inc., Illinois Tool Works Inc. (NYSE:ITW)., Juki Corporation (Tokyo :6440.T), Koh Young Technology Inc. (KOSDAQ:098460.KQ)., Kulicke & Soffa Pte Ltd., Mycronic AB, Naprotek, Inc., Nikon Metrology NV, Nordson DAGE, OMRON Corporation (Tokyo:6645.T), Orbotech, Ltd., Panasonic Corporation, Saki Corporation, Teradyne, Inc. (NasdaqGS:TER)., Universal Instruments Corporation, Viscom AG (XETRA :V6C.DE), Yamaha Motor Co., Ltd. (Other OTC:YAMHF)., YXLON International GmbH
What are the significant types of Surface Mount Technology (SMT) Equipment Market?
Placement Equipment, Printer Equipment, Reflow Oven Equipment, Others.
What are the major end-use applications of Surface Mount Technology (SMT) Equipment Market?
Consumer Electronics, Medical, Automotive, Telecommunications Equipment, Others
What segments are covered in the Surface Mount Technology (SMT) Equipment Market report?
The Global Surface Mount Technology (SMT) Equipment Market is Segmented on the basic of Product, Application, and Geography.
How can I get a sample report/company profile for the Surface Mount Technology (SMT) Equipment Market?
The sample report for the Surface Mount Technology (SMT) Equipment Market can be obtained on demand from the website. Also, the 24*7 chat support & direct call services are provided to procure the sample report.
SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.
PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.
MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.
EXPERT VALIDATION
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REPORT WRITING/ PRESENTATION
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